• Durable cement resistor for reliable performance.
• Ceramic and cement construction for heat resistance.
• Rated for 20W power, ideal for high-power circuits.
• 4.7K OHM resistance with a 5% tolerance for accuracy.

• Durable Material: Constructed from high-quality plastic for lasting performance
• Easy Adjustment: Ergonomically designed handle for comfortable grip and precise leveling
• Wide Compatibility: Suitable for 3D printers using M4 screws for platform leveling
• Enhanced Stability: Ensures a leveled hot bed, resulting in improved print quality

• High-power rating of 20W for robust performance in demanding applications.
• Durable ceramic and cement construction for efficient heat dissipation.
• Resistance value of 10 OHM with 5% tolerance for stable operation.
• White color for easy identification and integration into electronic circuits.

• 30W power rating for high-power applications
• Constructed with ceramic and cement for durability
• 5% tolerance for accurate resistance
• White color for easy visibility

Specifications:

• Back-illuminated, stacked CMOS 12-megapixel Sony IMX708 image sensor
• High signal-to-noise ratio (SNR)
• Built-in 2D Dynamic Defect Pixel Correction (DPC)
• Phase Detection Autofocus (PDAF) for rapid autofocus
• QBC Re-mosaic function
• HDR mode (up to 3 megapixel output)
• CSI-2 serial data output
• 2-wire serial communication (supports I2C fast mode and fast mode plus)
• 2-wire serial control of focus mechanism
• Resolution: 11.9 megapixels
• Sensor size: 7.4mm sensor diagonal
• Pixel size: 1.4μm × 1.4μm
• Horizontal/vertical: 4608 × 2592 pixels
• Diagonal field of view: 75 degrees (Camera Module 3, Camera Module 3 NoIR), 120 degrees (Camera Module 3 Wide, Camera Module 3 NoIR Wide)
• Common video modes: 1080p50, 720p100, 480p120
• Output: RAW10