UV50 50g High Synthetic BGA Solder Flux Paste
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Specifications:
- Material: Plastic + Rosin-based solder paste
- Size: 50 grams
- Type: Rosin-based BGA solder flux cream
- Model Number: UV50
- Viscosity: 0.2 Pas
- Granularity: 0.22 µm
- Application: Phone BGA board soldering and fixing
- Function: PC cards and electronic chip-level welding
Package:
- 1 x UV50 50g High Synthetic BGA Solder Flux Paste
Product Description
Features:
- High-quality rosin-based solder flux paste.
- Specially designed for BGA, SMD, and PGA soldering repairs.
- Ideal for mobile phone PCB and chip-level welding tasks.
- Provides excellent soldering performance with minimal residue.
- Compact and easy-to-use packaging.
Description:
The UV50 High Synthetic BGA Solder Flux Paste is an essential tool for professional soldering and repair tasks. With its rosin-based formula, it ensures high-performance soldering, making it ideal for mobile phone PCB, BGA boards, and electronic chip-level welding. Its precise viscosity and granularity allow for excellent adhesion and minimal residue, ensuring clean and efficient repairs. Latest price in Bangladesh (BD) is available on our website.
FAQ:
Q1: What is the primary use of this solder flux paste?
A1: It is designed for BGA, SMD, and PGA soldering repairs, especially for mobile phone PCB and chip-level welding tasks.
Q2: Does it leave any residue after soldering?
A2: This flux paste is formulated to leave minimal residue, ensuring a clean finish after soldering.
Q3: What is the weight of this product?
A3: It comes in a 50-gram package, ideal for multiple repair tasks.